Embedded Die Packaging Technology Market

Global Embedded Die Packaging Technology Market Expected to Reach $68 Million, by 2023

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According to a new report published by Allied Market Research, titled, “Embedded Die Packaging Technology Market by Platform and Industry Vertical: Global Opportunity Analysis and Industry Forecast, 2017-2023,” the global embedded die packaging technology market was valued at $26 million in 2016, and is projected to reach $68 million by 2023, growing at a CAGR of 14.8% from 2017 to 2023. The embedded die in IC package substrate segment contributed nearly 47% share to the global market in 2016.

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Increase in number of portable electronic devices, impending need for circuit miniaturization in microelectronic devices, rise in application for healthcare and automotive devices, and advantages over other advanced packaging technologies are some of the factors that drive market. However, high cost of these chips restrains the market growth. Moreover, growth in trend of Internet of Things (IoT) globally is expected to provide new opportunities for the players operating in the market.

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In 2016, embedded die in IC package substrate is expected to maintain its dominant position throughout the analysis period, owing to its wide-scale adoption for DCDC converters and camera modules used in smartphones.

Moreover, Asia-Pacific is the major revenue contributor, owing to the market contribution of countries, such as China, Japan, and Taiwan, which claim most of the share of the overall semiconductor market globally. High population base and rise in demand for portable electronics industry boost the growth of the market in Asia-Pacific.

Consumer electronics and IT & Telecommunication segments collectively dominated with over 60% share in 2016. The use of embedded die packaging technology in consumer electronics is attributed to the rapid growth of wireless portable electronics devices in smartphones and other mobile devices.

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Key Findings of the Embedded Die Packaging Technology Market:

  • In terms of revenue, consumer electronics and IT & telecommunication collectively contributed the maximum market share in 2016, and are expected to maintain their dominance throughout the forecast period.
  • The embedded die in flexible board segment is expected to grow at the highest CAGR during the forecast period.
  • In 2016, the embedded die in IC package substrate platform held nearly half of the market share, which was the highest among all the platform types.
  • In 2016, Asia-Pacific accounted for over 50% share globally, and is expected to dominate the market in the near future.

In 2016, in terms of revenue, Asia-Pacific accounted for over half of the market, and is expected to maintain its dominant position, owing to the presence of the developing countries, high growth in IT & telecommunication sector, well-established semiconductor market, government initiatives, and rise in trend of IoT.

The major companies profiled in the report include Amkor Technology, Taiwan Semiconductor Manufacturing Company, ASE Group, AT & S, General Electric, Infineon, Fujikura, MicroSemi, TDK-Epcos, and Schweizer.

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